Uni-forms Epoxy Systems

All Uni-forms are made from electrical grade epoxy systems. These systems offer advantages such as wave solder compatibility, fungus resistivity, negligible volatile outgassing, and excellent thermal shock properties. Specialty systems exist for high-temperature applications, oil/freon environments, and other demanding conditions.

Epoxy System	Available Colors	Description	Cure Schedule Options
DC-202	Black	Low to medium flow, highly cross-linked epoxy system. Designed for sealing PCB components. Holds up well to industrial solvent exposure and soldering temperatures up to 325°C.	212°F (100°C) for 4 hours minimum 250°F (125°C) for 1 hour minimum 300°F (150°C) for 30 minutes minimum 350°F (175°C) for 15 minutes minimum
DC-202LT	Black Red	Low cure-temperature, low to medium flow, highly cross-linked epoxy system. Designed for use on low temperature components. Holds up well to industrial solvent exposure and soldering temperatures up to 325°C.	212°F (100°C) for 2 hours minimum 250°F (125°C) for 30 minutes minimum 300°F (150°C) for 15 minutes minimum 350°F (175°C) for 5 minutes minimum
DC-203	Blue Green Red	Medium to high flow, highly cross-linked epoxy system. Designed for sealing PCB components. Holds up well to industrial solvent exposure and soldering temperatures up to 325°C.	212°F (100°C) for 4 hours minimum 250°F (125°C) for 1 hour minimum 300°F (150°C) for 30 minutes minimum 350°F (175°C) for 15 minutes minimum
DC-204	Black	High flow, highly cross-linked epoxy system. Designed for maximum coverage and penetration in sealing PCB components. Holds up well to industrial solvent exposure and soldering temperatures up to 325°C.	212°F (100°C) for 4 hours minimum 250°F (125°C) for 1 hour minimum 300°F (150°C) for 30 minutes minimum 350°F (175°C) for 15 minutes minimum
DC-207	Red	High-flow, highly cross-linked epoxy system designed for Freon/oil mix environment. Passes UL984. Holds up well to industrial solvent exposure and soldering temperatures up to 325°C.	300°F (150°C) for 4 hours minimum 350°F (175°C) for 2 hours minimum 400°F (200°C) for 1 hour minimum 450°F (235°C) for 40 minutes minimum
M5-82	Red	High-flow, linear epoxy system that remains flexible under temperature changes. Designed for under-the-hood automotive applications where seal integrity is required in adverse temperature and weather conditions, including salt spray, oil, grease, and fluids. Holds up marginally to industrial solvent exposure.	300°F (150°C) for 2 hours minimum 350°F (175°C) for 90 minutes minimum
M5-92	Black Red	High-flow, extremely cross-linked epoxy system. 160°C Tg system designed for high-temperature applications. Impervious to most industrial solvent exposure.	300°F (150°C) for 2 hours minimum 350°F (175°C) for 90 minutes minimum 400°F (200°C) for 1 hour minimum 450°F (235°C) for 40 minutes minimum
M17-19	Black Red	High-flow, extremely cross-linked epoxy system. 160°C Tg system designed for high-temperature applications. Impervious to most industrial solvent exposure.	300°F (150°C) for 4 hours minimum 350°F (175°C) for 2 hours minimum 400°F (200°C) for 1 hour minimum 450°F (235°C) for 40 minutes minimum

CURE METHOD: We recommend the use of forced convection ovens for curing our epoxy systems. When using static air ovens, recommended cure times should be doubled. Recommended cure schedules are for epoxy only. Place thermocouples throughout the oven to determine the influence of component mass on oven temperature and recovery time. The time required for all thermocouples to reach cure temperature should be added to MSI's listed cure schedules. For production purposes, adequate cure schedules should be determined and strictly adhered to. Ovens should be calibrated at least once a year.