Poly-forms Processing Schedules

The temperature and time required to process Poly-form (F05) flexible adhesive films depend upon component materials, design, and seal requirements. Adding pressure and increasing oven temperature and time improves adhesion. The minimum processing temperature is 225°F (107°C). A typical processing schedule is 275°F (135°C) for 10 minutes under 5 psi. Additional processing profiles are shown on the chart below. Recommended profiles are based on test data for stainless steel bonded to stainless steel.

We recommend the use of forced convection ovens for processing our adhesives. When using static air ovens, recommended schedules should be doubled. Recommended schedules are for adhesive only. Place thermocouples throughout the oven to determine the influence of component mass on oven temperature and recovery time. The time required for all thermocouples to reach processing temperature should be added to MSI's listed schedules. For production purposes, adequate processing schedules should be determined and strictly adhered to. Ovens should be calibrated at least once a year.

PLEASE NOTE: This information is based on data obtained by our own research and is considered accurate. However, no warranty is expressed or implied regarding the accuracy of these data, the results to be obtained from the use thereof, or that any such use will not infringe any patent. This information is furnished up the condition that the person receiving it shall make his own tests to determine the suitability thereof for his particular purpose.